BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

Abstract: a method of fabricating an electronic device includes attaching a first side of a tape to a first side of a wafer and etching an opposite second side of the tape using a laser. the method includes planarizing an opposite second side of the wafer with the first side of the wafer attached to the first side of the tape, and separating a semiconductor die from the wafer after grinding the second side of the wafer.

Inventor(s): Jezreel Duane Aquino, Jeniffer Aspuria, Jun Bautista

CPC Classification: H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general )})

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