18508239. SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS simplified abstract (MICRON TECHNOLOGY, INC.)

SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS

Organization Name

MICRON TECHNOLOGY, INC.

Inventor(s)

Jeremy E. Minnich of Boise ID (US)

Andrew M. Bayless of Boise ID (US)

SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18508239 titled 'SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS

Simplified Explanation

The patent application describes a semiconductor substrate with sacrificial material that allows for easy separation of the center and peripheral portions of the substrate.

• The semiconductor substrate has a center portion and a peripheral portion.
• An annulus of sacrificial material is placed at the front side of the substrate, separating the center and peripheral portions.
• Thinning the substrate exposes the sacrificial material, enabling disconnection of the peripheral portion from the center portion.
• The thinned substrate has a smooth edge, enhancing its mechanical strength.

Key Features and Innovation

• Semiconductor substrate with sacrificial material for easy separation.
• Thinning process to disconnect center and peripheral portions.
• Smooth edge design for increased mechanical robustness.

Potential Applications

This technology can be used in:

• Semiconductor manufacturing
• Microelectronics
• MEMS devices

Problems Solved

• Facilitates easy separation of different portions of the semiconductor substrate.
• Enhances mechanical strength and robustness of the thinned substrate.

Benefits

• Simplifies manufacturing processes.
• Improves the reliability of semiconductor devices.
• Reduces the risk of damage during handling.

Commercial Applications

• This technology can be applied in the production of various semiconductor devices, leading to more reliable and durable products in the market.

Prior Art

Readers can explore prior research on sacrificial material in semiconductor manufacturing and thinning processes for substrates to understand the background of this innovation.

Frequently Updated Research

Stay updated on the latest advancements in sacrificial material technologies and thinning processes in semiconductor manufacturing to enhance your understanding of this field.

Questions about Semiconductor Substrate with Sacrificial Material

How does the sacrificial material aid in separating the center and peripheral portions of the semiconductor substrate?

The sacrificial material creates a physical barrier that allows for easy disconnection of the different substrate portions during the thinning process.

What are the potential implications of using sacrificial material in semiconductor manufacturing beyond substrate separation?

Sacrificial material can also be utilized in other processes such as etching and releasing structures in microelectronics, expanding its applications in the industry.

Original Abstract Submitted

A semiconductor substrate is provided. The semiconductor substrate includes a center portion and a peripheral portion. The semiconductor substrate further includes an annulus of sacrificial material disposed at a front side of the semiconductor substrate and extending at least partially through the semiconductor substrate. The annulus of sacrificial material separates the center portion of the substrate from the peripheral portion of the substrate at the front side. The semiconductor substrate can be thinned to expose the annulus of sacrificial material and disconnect the peripheral portion from the center portion. In doing so, the thinned substrate may have a planar substrate edge void of sharp edges, thereby increasing its mechanical robustness.