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Category:Tarek Ibrahim of Mesa AZ US

From WikiPatents

Tarek Ibrahim

Tarek Ibrahim from Mesa AZ US has applied for patents in technology areas such as H01L23/29, H01L23/00, H01L23/31 with intel corporation.

Patents

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (20250112100)

Pages in category "Tarek Ibrahim of Mesa AZ US"

The following 5 pages are in this category, out of 5 total.

1

18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
18375209. DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY (INTEL CORPORATION)

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