Category:Tchefor Ndukum of Chandler AZ US
Tchefor Ndukum
Tchefor Ndukum from Chandler AZ US has applied for patents in technology areas such as H01L23/482, H01L23/00, H01L23/31 with intel corporation.
Patents
Pages in category "Tchefor Ndukum of Chandler AZ US"
The following 6 pages are in this category, out of 6 total.
1
- 18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18374609. STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
I
- Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Intel corporation (20250112140). STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING