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Category:Matthew Tingey of Mesa AZ US

From WikiPatents

Matthew Tingey

Matthew Tingey from Mesa AZ US has applied for patents in technology areas such as H01L23/482, H01L23/00, H01L23/31 with intel corporation.

Patents

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (20250112124)

Pages in category "Matthew Tingey of Mesa AZ US"

The following 2 pages are in this category, out of 2 total.

1

18374555. DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)

I

Intel corporation (20250112124). DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

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