Category:Junghoon Kang of Suwon-si KR
Junghoon Kang
Junghoon Kang from Suwon-si KR has applied for patents in technology areas such as G02B6/42, H01L23/00, H01L23/13 with samsung electronics co., ltd..
Patents
Pages in category "Junghoon Kang of Suwon-si KR"
The following 20 pages are in this category, out of 20 total.
1
- 18676584. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18747906. SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP (SAMSUNG ELECTRONICS CO., LTD.)
- 18772409. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18773021. SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP (Samsung Electronics Co., Ltd.)
- 18775260. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18780675. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18780730. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18787653. SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP (Samsung Electronics Co., Ltd.)
- 18887727. SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP (SAMSUNG ELECTRONICS CO., LTD.)
S
- Samsung electronics co., ltd. (20250015062). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250022859). SEMICONDUCTOR PACKAGE WITH GLASS CORE SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Samsung electronics co., ltd. (20250093594). SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP
- Samsung electronics co., ltd. (20250102748). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250105231). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250116810). SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
- Samsung electronics co., ltd. (20250123447). SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP
- Samsung electronics co., ltd. (20250125312). SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC CHIP
- Samsung electronics co., ltd. (20250125321). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250149516). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250149520). SEMICONDUCTOR PACKAGE