SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP

Organization Name

Inventor(s)

SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP

This abstract first appeared for US patent application 20250093594 titled 'SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP

Original Abstract Submitted

a semiconductor package includes a package substrate including an alignment hole extending inwardly from a side surface of the package substrate, a photonic integrated circuit chip disposed on the package substrate, the of the package substrate chip including a groove extending inwardly from a side surface of the pic chip and a photo-electron conversion unit including an edge coupler, and an optical fiber connector including a frame, an optical fiber mounted in the groove of the of the package substrate chip and passing through the frame, and an alignment pin extending from the frame to an inside of the alignment hole, wherein the edge coupler is located at one end of the photo-electron conversion unit.