18772409. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Junghoon Kang of Suwon-si KR

Daegon Kim of Suwon-si KR

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 18772409 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

A semiconductor package including a package substrate defining a groove extending from an upper surface of the package substrate into the package substrate; a photonic integrated circuit (PIC) chip inside the groove of the package substrate; an interposer above the PIC chip and the package substrate, the interposer including a core substrate; an electronic integrated circuit (EIC) chip inside the interposer; and a semiconductor chip above the interposer. The interposer defines a cavity extending from an upper surface of the core substrate to a lower surface of the core substrate, and the EIC chip is inside the cavity of the core substrate.