Samsung electronics co., ltd. (20250015062). SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 20250015062 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
a semiconductor package includes: a first redistribution substrate; a module structure on the first redistribution substrate; a first molding layer on the first redistribution substrate and surrounding the module structure; and a vertical connection structure on a side of the module structure, the vertical connection structure vertically extending and connected to the first redistribution substrate, wherein the module structure includes: an interposer substrate including a glass substrate, and a first semiconductor chip mounted on the interposer substrate; and a second semiconductor chip mounted on the interposer substrate.