18787653. SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP
This abstract first appeared for US patent application 18787653 titled 'SEMICONDUCTOR PACKAGE WITH PHOTONIC CHIP
Original Abstract Submitted
Provided is a semiconductor package including a package substrate and a photonic integrated circuit chip arranged on the package substrate, having a groove extending from a lateral surface of the photonic integrated circuit chip to the inside of the photonic integrated circuit chip, and including a photoelectric converter, wherein the photoelectric converter includes a light-emitting device configured to generate an optical signal, a first waveguide connected to the light-emitting device and providing a path through which the optical signal travels, a first grating coupler configured to output the optical signal, a second waveguide connected to first grating coupler, and a tunable coupler connected to the first waveguide and the second waveguide.