Samsung electronics co., ltd. (20250116810). SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
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SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
This abstract first appeared for US patent application 20250116810 titled 'SEMICONDUCTOR PACKAGE WITH PHOTONICS CHIP
Original Abstract Submitted
a semiconductor package includes an interposer including an interposer optical waveguide, and a plurality of chiplets coupled onto the interposer and each including a semiconductor chip and a photonics chip electrically coupled to the semiconductor chip, wherein the photonics chip includes a photonic integrated circuit configured to input or output an optical signal, and an optical waveguide optically coupled to the interposer optical waveguide.