Category:Johanna Swan of Scottsdale AZ US
Johanna Swan
Johanna Swan from Scottsdale AZ US has applied for patents in technology areas such as H01L21/683, H01L23/00, H01L25/065 with intel corporation.
Patents
Pages in category "Johanna Swan of Scottsdale AZ US"
The following 19 pages are in this category, out of 19 total.
1
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18473711. SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS (Intel Corporation)
- 18473905. SELECTIVE LAYER TRANSFER (Intel Corporation)
- 18478391. ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS (INTEL CORPORATION)
- 18478686. SELECTIVE LAYER TRANSFER WITH GLASS PANELS (INTEL CORPORATION)
- 18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION)
- 18478843. SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES (INTEL CORPORATION)
- 18478855. DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TECHNOLOGY (INTEL CORPORATION)
- 18478963. REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER (INTEL CORPORATION)
I
- Intel corporation (20250105046). SELECTIVE LAYER TRANSFER
- Intel corporation (20250105053). SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Intel corporation (20250112067). REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Intel corporation (20250112077). ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS
- Intel corporation (20250112196). SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY
- Intel corporation (20250112204). DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TECHNOLOGY
- Intel corporation (20250112208). SELECTIVE LAYER TRANSFER WITH GLASS PANELS
- Intel corporation (20250112218). SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS