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Category:C23C16/14
Subcategories
This category has the following 3 subcategories, out of 3 total.
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Y
Pages in category "C23C16/14"
The following 15 pages are in this category, out of 15 total.
1
- 18093156. PLASMA-ENHANCED MOLYBDENUM DEPOSITION simplified abstract (Applied Materials, Inc.)
- 18118017. HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES simplified abstract (Applied Materials, Inc.)
- 18547481. NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES simplified abstract (Lam Research Corporation)
- 18624402. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)
- 18886400. METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM (Kokusai Electric Corporation)
A
- Applied materials, inc. (20240258109). METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER simplified abstract
- Applied materials, inc. (20240304495). HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES simplified abstract
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on January 30th, 2025
- Applied Materials, Inc. patent applications on September 12th, 2024
T
- Tokyo electron limited (20240295020). METHOD AND APPARATUS FOR EMBEDDING TUNGSTEN INTO RECESS FORMED ON SUBSTRATE simplified abstract
- Tokyo electron limited (20240337022). FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract
- Tokyo Electron Limited patent applications on October 10th, 2024
- Tokyo Electron Limited patent applications on September 5th, 2024