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Category:B24B37/26
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This category has the following 29 subcategories, out of 29 total.
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Pages in category "B24B37/26"
The following 27 pages are in this category, out of 27 total.
1
- 18210819. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18347707. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF REPLACING POLISHING PAD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18377591. EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
- 18377615. GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
- 18417304. APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18477159. CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES (Applied Materials, Inc.)
- 18486094. POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS (Applied Materials, Inc.)
- 18667585. CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18732911. BUFFING TREATMENT MODULE INCLUDING BUFFING PAD (SAMSUNG ELECTRONICS CO., LTD.)
- 18946379. CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME (Samsung Electronics Co., Ltd.)
A
- Applied materials, inc. (20250108477). CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
- Applied materials, inc. (20250114897). EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250114901). GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250121472). POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 17th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
S
- Samsung electronics co., ltd. (20240217057). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF REPLACING POLISHING PAD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240217059). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract
- Samsung electronics co., ltd. (20250100101). BUFFING TREATMENT MODULE INCLUDING BUFFING PAD
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025