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Applied materials, inc. (20250121472). POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS

From WikiPatents

POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS

Organization Name

applied materials, inc.

Inventor(s)

Liu Jiang of Dublin CA US

Prayudi Lianto of Singapore SG

Santosh Kumar Rath of Singapore SG

Nina Bao of Singapore SG

Muhammad Adli Danish of Singapore SG

Aniruddh Khanna of Fremont CA US

Pin Gian Gan of Singapore SG

Mohammad Faizal Bin Aermie Ang of Singapore SG

Mayu Yamamura of San Francisco CA US

Sivapackia Ganapathiappan of Los Altos CA US

Daniel Redfield of Morgan Hill CA US

El Mehdi Bazizi of San Jose CA US

Yen-Chu Yang of Santa Clara CA US

Pang Yen Ong of Singapore SG

Rajeev Bajaj of San Jose CA US

POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS

This abstract first appeared for US patent application 20250121472 titled 'POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS

Original Abstract Submitted

printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. one or more first polishing elements have a shore d hardness of greater than 60, one or more second polishing elements have a shore d hardness of from about 20 to less than 60, and the polishing article has a total shore d hardness of greater than or about 50.

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