Applied materials, inc. (20250121472). POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
Organization Name
Inventor(s)
Prayudi Lianto of Singapore SG
Santosh Kumar Rath of Singapore SG
Muhammad Adli Danish of Singapore SG
Aniruddh Khanna of Fremont CA US
Mohammad Faizal Bin Aermie Ang of Singapore SG
Mayu Yamamura of San Francisco CA US
Sivapackia Ganapathiappan of Los Altos CA US
Daniel Redfield of Morgan Hill CA US
El Mehdi Bazizi of San Jose CA US
Yen-Chu Yang of Santa Clara CA US
Rajeev Bajaj of San Jose CA US
POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
This abstract first appeared for US patent application 20250121472 titled 'POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
Original Abstract Submitted
printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. one or more first polishing elements have a shore d hardness of greater than 60, one or more second polishing elements have a shore d hardness of from about 20 to less than 60, and the polishing article has a total shore d hardness of greater than or about 50.
- Applied materials, inc.
- Liu Jiang of Dublin CA US
- Prayudi Lianto of Singapore SG
- Santosh Kumar Rath of Singapore SG
- Nina Bao of Singapore SG
- Muhammad Adli Danish of Singapore SG
- Aniruddh Khanna of Fremont CA US
- Pin Gian Gan of Singapore SG
- Mohammad Faizal Bin Aermie Ang of Singapore SG
- Mayu Yamamura of San Francisco CA US
- Sivapackia Ganapathiappan of Los Altos CA US
- Daniel Redfield of Morgan Hill CA US
- El Mehdi Bazizi of San Jose CA US
- Yen-Chu Yang of Santa Clara CA US
- Pang Yen Ong of Singapore SG
- Rajeev Bajaj of San Jose CA US
- B24B37/26
- B24B37/22
- B24D18/00
- CPC B24B37/26