Samsung electronics co., ltd. (20250100101). BUFFING TREATMENT MODULE INCLUDING BUFFING PAD
BUFFING TREATMENT MODULE INCLUDING BUFFING PAD
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BUFFING TREATMENT MODULE INCLUDING BUFFING PAD
This abstract first appeared for US patent application 20250100101 titled 'BUFFING TREATMENT MODULE INCLUDING BUFFING PAD
Original Abstract Submitted
a buffing treatment module includes: a buffing table that supports a substrate; a buffing head located on the buffing table and configured to rotate; and a buffing pad attached to a lower part of the buffing head and rotating while in contact with the substrate for performing buffing treatment on the substrate, wherein the buffing pad includes: a base unit; a plurality of protrusion units that protrude from a surface of the base unit and are spaced apart from each other in a circumferential direction of the base unit; and a plurality of trench units positioned adjacent to the plurality of protrusion units, and extending from a center portion of the base unit to an edge portion of the base unit, wherein the plurality of trench units are spaced apart from each other in the circumferential direction of the base unit.