18417304. APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
Organization Name
Inventor(s)
Surajit Kumar of San Jose CA (US)
Hari Soundararajan of Sunnyvale CA (US)
Shou-Sung Chang of Mountain View CA (US)
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18417304 titled 'APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
Simplified Explanation
The patent application describes a chemical mechanical polishing apparatus with a temperature control system that delivers heated or coolant fluid onto the polishing pad through a plenum with multiple openings, each delivering a different amount of fluid.
- The apparatus includes a rotatable platen to hold the polishing pad, a carrier for the substrate, and a temperature control system with a fluid source and a plenum with multiple openings.
- The plenum is positioned over the platen and separated from the polishing pad, with some openings delivering varying amounts of fluid onto the pad.
Potential Applications
This technology could be applied in semiconductor manufacturing processes where precise temperature control is crucial for achieving high-quality polishing results.
Problems Solved
1. Inconsistent temperature control during the polishing process. 2. Inefficient cooling or heating of the polishing pad.
Benefits
1. Improved polishing quality and consistency. 2. Enhanced substrate flatness and surface finish. 3. Increased productivity and efficiency in the polishing process.
Potential Commercial Applications
Optimizing Chemical Mechanical Polishing for Semiconductor Manufacturing
Possible Prior Art
There may be prior art related to temperature control systems in chemical mechanical polishing apparatuses, but specific examples are not provided in the abstract.
Unanswered Questions
How does this technology compare to existing temperature control systems in chemical mechanical polishing apparatuses?
This article does not provide a direct comparison with existing systems, making it unclear how this innovation differs or improves upon current technologies.
What are the specific fluid types used in the temperature control system, and how do they affect the polishing process?
The abstract does not mention the specific types of fluids used or their impact on the polishing process, leaving this aspect unaddressed.
Original Abstract Submitted
A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of heated or coolant fluid and a plenum having a plurality of openings positioned over the platen and separated from the polishing pad for delivering the fluid onto the polishing pad, wherein at least some of the openings are each configured to deliver a different amount of the fluid onto the polishing pad.
