Category:Yosuke Kanaoka of Chandler AZ US
Yosuke Kanaoka
Yosuke Kanaoka from Chandler AZ US has applied for patents in technology areas such as H01L25/065, H01L23/00, H01L23/29 with intel corporation.
Patents
Pages in category "Yosuke Kanaoka of Chandler AZ US"
The following 9 pages are in this category, out of 9 total.
1
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18475326. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (Intel Corporation)
- 18475373. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (Intel Corporation)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
I
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH
- Intel corporation (20250112161). METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING