Category:Minglu Liu of Chandler AZ US
Minglu Liu
Minglu Liu from Chandler AZ US has applied for patents in technology areas such as H01L23/15, H01L23/24, H01L23/367 with intel corporation.
Patents
Pages in category "Minglu Liu of Chandler AZ US"
The following 20 pages are in this category, out of 20 total.
1
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)
- 18475326. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH (Intel Corporation)
- 18475373. HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH (Intel Corporation)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
I
- Intel corporation (20250006569). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006571). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FILM CAPACITORS
- Intel corporation (20250006609). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006610). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006611). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006612). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006613). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS INCLUDING INTERCONNECT BRIDGES
- Intel corporation (20250006665). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRENCH CAPACITORS
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112161). METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES
- Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING