Category:Yiqun Bai of Chandler AZ US
Yiqun Bai
Yiqun Bai from Chandler AZ US has applied for patents in technology areas such as H01L23/15, H01L23/00, H01L23/13 with intel corporation.
Patents
Pages in category "Yiqun Bai of Chandler AZ US"
The following 20 pages are in this category, out of 20 total.
1
- 18373457. STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION (Intel Corporation)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375244. APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES (INTEL CORPORATION)
- 18478077. POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE (INTEL CORPORATION)
- 18478538. METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES (INTEL CORPORATION)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
2
- 20250183182. Microelectronic Assemblie (Unknown Organization)
- 20250218880. Microelectronic Assemblies W (Intel)
- 20250218926. Microelectronic Assemblies I (Intel)
- 20250218960. Methods Apparatus Emb (Intel)
- 20250218964. Technologies Connected C (Intel)
- 20250219021. Vertically Embedded Componen (Intel)
I
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- Intel corporation (20250106983). STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Intel corporation (20250110295). POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE
- Intel corporation (20250112085). APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112161). METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SUBSTRATES
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT