Category:Haifa Hariri of Phoenix AZ US
Haifa Hariri
Haifa Hariri from Phoenix AZ US has applied for patents in technology areas such as H05K1/02, H01L23/15, H01L23/498 with intel corporation.
Patents
Pages in category "Haifa Hariri of Phoenix AZ US"
The following 11 pages are in this category, out of 11 total.
1
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18984426. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984438. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984444. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984454. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
I
- Intel corporation (20250113434). THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION
- Intel corporation (20250120102). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125201). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125202). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250126814). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES