Category:Whitney Bryks of Tempe AZ US
Whitney Bryks
Whitney Bryks from Tempe AZ US has applied for patents in technology areas such as H01L23/498 with intel corporation.
Patents
Pages in category "Whitney Bryks of Tempe AZ US"
The following 19 pages are in this category, out of 19 total.
1
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
- 18375203. THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES (INTEL CORPORATION)
- 18477638. MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES (INTEL CORPORATION)
- 18984426. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984438. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984444. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
- 18984454. PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES (Intel Corporation)
2
I
- Intel corporation (20250006623). FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED POROSITY
- Intel corporation (20250022786). METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112163). THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Intel corporation (20250112175). MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Intel corporation (20250120102). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125201). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250125202). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Intel corporation (20250126814). PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES