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- 04:07, 26 April 2024 International business machines corporation (20240138074). REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL simplified abstract (hist) [3,842 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128232). SEMICONDUCTOR PACKAGE simplified abstract (hist) [4,748 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128231). Semiconductor Devices and Methods of Manufacture simplified abstract (hist) [4,449 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 International business machines corporation (20240138064). MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract (hist) [4,699 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128218). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [4,337 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 International business machines corporation (20240137465). DYNAMICALLY CONTROLLING FOREGROUND APPLICATIONS DURING SCREEN SHARING CONFERENCES simplified abstract (hist) [4,160 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128217). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,942 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137375). FOUNDATIONAL MODEL FOR NETWORK PACKET TRACES simplified abstract (hist) [4,502 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137303). PROCESSING DATA CONNECTION REQUESTS FROM EDGE DEVICES simplified abstract (hist) [3,910 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract (hist) [4,741 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract (hist) [5,133 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137205). EFFICIENT RANDOM MASKING OF VALUES WHILE MAINTAINING THEIR SIGN UNDER FULLY HOMOMORPHIC ENCRYPTION (FHE) simplified abstract (hist) [3,994 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract (hist) [3,590 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128194). Integrated Circuit Packages and Methods of Forming the Same simplified abstract (hist) [3,902 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128178). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (hist) [4,211 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136414). SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY simplified abstract (hist) [4,613 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128157). Semiconductor Package and Method of Manufacturing the Same simplified abstract (hist) [3,591 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136289). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract (hist) [3,973 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128149). COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE simplified abstract (hist) [3,525 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136288). Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device simplified abstract (hist) [4,815 bytes] Wikipatents (talk | contribs) (Creating a new page)