Taiwan semiconductor manufacturing co., ltd. (20240128231). Semiconductor Devices and Methods of Manufacture simplified abstract
Contents
- 1 Semiconductor Devices and Methods of Manufacture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Semiconductor Devices and Methods of Manufacture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Semiconductor Devices and Methods of Manufacture
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Pei-Wei Lee of Kaohsiung City (TW)
Yun-Chung Wu of Taipei City (TW)
Bo-Yu Chiu of Taoyuan City (TW)
Szu-Hsien Lee of Tainan City (TW)
Mirng-Ji Lii of Sinpu Township (TW)
Semiconductor Devices and Methods of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128231 titled 'Semiconductor Devices and Methods of Manufacture
Simplified Explanation
The abstract describes a method of manufacturing semiconductor devices by bonding multiple substrates together and patterning them to form openings.
- First bonding layer deposited on a first substrate
- Patterning first bonding layer and semiconductor substrate to form first openings
- Bonding a second substrate to the first substrate
- Patterning the second substrate to form second openings, exposing at least one of the first openings
- Bonding a third substrate to the second substrate
- Patterning the third substrate to form third openings, exposing at least one of the second openings
Potential Applications
This technology could be applied in the manufacturing of advanced semiconductor devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This method solves the problem of efficiently bonding multiple substrates together while maintaining precise alignment for patterning.
Benefits
The benefits of this technology include increased device performance, higher integration density, and improved reliability due to the precise patterning of openings.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of high-performance electronic devices for consumer electronics, automotive, and industrial applications.
Possible Prior Art
One possible prior art for this technology could be the use of wafer bonding techniques in semiconductor manufacturing processes to create multi-layered structures.
What are the specific semiconductor materials used in this method?
The specific semiconductor materials used in this method are not mentioned in the abstract. Further details on the types of semiconductor substrates and metallization layers would be needed to answer this question.
How does the patterning process ensure alignment accuracy between the different substrates?
The abstract does not provide specific details on how the patterning process ensures alignment accuracy between the different substrates. Additional information on the patterning techniques and alignment methods used would be required to address this question.
Original Abstract Submitted
semiconductor devices and methods of manufacturing the semiconductor devices are presented. in embodiments the methods of manufacturing include depositing a first bonding layer on a first substrate, wherein the first substrate comprises a semiconductor substrate and a metallization layer. the first bonding layer and the semiconductor substrate are patterned to form first openings. a second substrate is bonded to the first substrate. after the bonding the second substrate, the second substrate is patterned to form second openings, at least one of the second openings exposing at least one of the first openings. after the patterning the second substrate, a third substrate is bonded to the second substrate, and after the bonding the third substrate, the third substrate is patterned to form third openings, at least one of the third openings exposing at least one of the second openings.
