International business machines corporation (20240138064). MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD

Organization Name

international business machines corporation

Inventor(s)

James D. Bielick of Pine Island MN (US)

Theron Lee Lewis of Rochester MN (US)

David J. Braun of St. Charles MN (US)

John R. Dangler of Rochester MN (US)

Timothy P. Younger of Rochester MN (US)

Stephen Michael Hugo of Stewartville MN (US)

Timothy Jennings of Rochester MN (US)

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240138064 titled 'MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD

Simplified Explanation

The method described in the abstract involves fabricating a multilayer circuit board with an internal clearance region that has a modified voltage-to-ground clearance of conductive material adjacent to an aperture. This modified clearance is based on the configuration of a connector pin to be press-fit connected within the aperture, and the internal clearance region is enlarged in the direction of greatest normal force outward from the aperture with insertion of the connector pin.

• Explanation:
• Fabricating a multilayer circuit board
• Internal clearance region with modified voltage-to-ground clearance
• Conductive material adjacent to an aperture
• Configuration of connector pin for press-fit connection
• Enlarged internal clearance region with insertion of connector pin

1. 1. 1. Potential Applications

The technology can be applied in the manufacturing of electronic devices, such as smartphones, tablets, and computers.

1. 1. 1. Problems Solved

This technology helps in improving the reliability and performance of multilayer circuit boards by optimizing the clearance of conductive material near connector pins.

1. 1. 1. Benefits

- Enhanced reliability of electronic devices - Improved performance of multilayer circuit boards - Efficient utilization of space in electronic devices

1. 1. 1. Potential Commercial Applications

Optimizing the clearance of conductive material in multilayer circuit boards can be beneficial for electronics manufacturers looking to enhance the quality of their products.

1. 1. 1. Possible Prior Art

One possible prior art could be the use of specialized connectors or insulating materials to address clearance issues in multilayer circuit boards.

1. 1. 1. 1. Unanswered Questions

1. 1. 1. 1. How does this technology compare to existing methods of optimizing clearance in multilayer circuit boards?

This article does not provide a direct comparison with existing methods, leaving room for further research and analysis to determine the advantages of this new approach.

1. 1. 1. 1. What are the specific parameters used to determine the modified voltage-to-ground clearance of conductive material in the internal clearance region?

The abstract does not delve into the specific calculations or criteria for determining the modified clearance, which could be crucial for understanding the practical implications of this technology.

Original Abstract Submitted

a method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. the modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.