International business machines corporation (20240138074). REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL simplified abstract
Contents
- 1 REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
Organization Name
international business machines corporation
Inventor(s)
Theron Lee Lewis of Rochester MN (US)
Timothy P. Younger of Rochester MN (US)
David J. Braun of St. Charles MN (US)
John R. Dangler of Rochester MN (US)
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138074 titled 'REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
Simplified Explanation
The abstract describes a method for forming an electronic device by solder bonding pins from a component to plated through holes of a board.
- Solder paste is applied to openings of the plated through holes on the opposite side of the board where the component is positioned.
- The solder paste is drawn to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.
Potential Applications
This technology can be applied in the manufacturing of various electronic devices such as circuit boards, sensors, and other electronic components.
Problems Solved
This method solves the problem of securely bonding components to circuit boards, ensuring reliable connections and functionality of electronic devices.
Benefits
The method provides a strong and reliable bond between components and circuit boards, improving the overall performance and durability of electronic devices.
Potential Commercial Applications
This technology can be utilized in industries such as electronics manufacturing, telecommunications, automotive, and consumer electronics for the production of high-quality electronic devices.
Possible Prior Art
One possible prior art could be the use of traditional soldering techniques for bonding components to circuit boards. However, the specific method described in this patent application may offer improvements in efficiency and reliability.
Unanswered Questions
How does this method compare to other soldering techniques in terms of cost-effectiveness and efficiency?
This article does not provide a direct comparison with other soldering techniques in terms of cost-effectiveness and efficiency. Further research or experimentation may be needed to determine the advantages of this method over others.
What are the potential challenges or limitations of implementing this solder bonding method in mass production?
The article does not address the potential challenges or limitations of implementing this solder bonding method in mass production. Factors such as scalability, equipment requirements, and training may need to be considered for large-scale production.
Original Abstract Submitted
a method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. the method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.
