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- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract (hist) [5,133 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137205). EFFICIENT RANDOM MASKING OF VALUES WHILE MAINTAINING THEIR SIGN UNDER FULLY HOMOMORPHIC ENCRYPTION (FHE) simplified abstract (hist) [3,994 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract (hist) [3,590 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128194). Integrated Circuit Packages and Methods of Forming the Same simplified abstract (hist) [3,902 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128178). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (hist) [4,211 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136414). SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY simplified abstract (hist) [4,613 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128157). Semiconductor Package and Method of Manufacturing the Same simplified abstract (hist) [3,591 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136289). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract (hist) [3,973 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128149). COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE simplified abstract (hist) [3,525 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136288). Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device simplified abstract (hist) [4,815 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128148). Integrated Circuit Packages and Methods of Forming the Same simplified abstract (hist) [4,695 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 International business machines corporation (20240136287). Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract (hist) [3,799 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128147). SEMICONDUCTOR DEVICE simplified abstract (hist) [2,896 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 International business machines corporation (20240136281). SELF-ALIGNED ZERO TRACK SKIP simplified abstract (hist) [4,178 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128143). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (hist) [4,064 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 International business machines corporation (20240136270). DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY simplified abstract (hist) [4,927 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128126). METHOD OF MANUFACTURING A SEMICONDUCTOR DEVCE simplified abstract (hist) [3,852 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128125). SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (hist) [3,552 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 International business machines corporation (20240136253). ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract (hist) [4,242 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 International business machines corporation (20240135978). MRAM DEVICE WITH OCTAGON PROFILE simplified abstract (hist) [3,857 bytes] Wikipatents (talk | contribs) (Creating a new page)