International business machines corporation (20240136281). SELF-ALIGNED ZERO TRACK SKIP simplified abstract

SELF-ALIGNED ZERO TRACK SKIP

Organization Name

international business machines corporation

Inventor(s)

Reinaldo Vega of Mahopac NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Takashi Ando of Eastchester NY (US)

David Wolpert of Poughkeepsie NY (US)

Albert M. Chu of Nashua NH (US)

Albert M. Young of Fishkill NY (US)

SELF-ALIGNED ZERO TRACK SKIP - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240136281 titled 'SELF-ALIGNED ZERO TRACK SKIP

Simplified Explanation

The semiconductor structure described in the abstract includes two levels of interconnect wiring, with the first level separated into two segments and the second level positioned orthogonally to the first level. The ends of the line segments on the first and second interconnect wiring segments are spaced closely together, with a spacing less than or equal to the spacing of the second level interconnect wiring.

• First level of interconnect wiring segmented into two segments
• Second level of interconnect wiring positioned orthogonally to the first level
• Ends of line segments on first and second interconnect wiring segments spaced closely together

Potential Applications

This technology could be applied in the semiconductor industry for the development of advanced integrated circuits and microprocessors.

Problems Solved

This innovation helps in reducing signal interference and improving the overall performance of semiconductor devices.

Benefits

The close spacing of the line segments allows for more efficient signal transmission and better overall functionality of the semiconductor structure.

Potential Commercial Applications

This technology could be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics.

Possible Prior Art

One possible prior art could be the use of multi-level interconnect wiring in semiconductor structures to improve signal transmission efficiency.

Unanswered Questions

How does this technology compare to existing methods of reducing signal interference in semiconductor structures?

This article does not provide a direct comparison to other methods of reducing signal interference, leaving the reader to wonder about the relative effectiveness of this innovation.

What are the specific challenges faced in implementing this technology on a large scale in semiconductor manufacturing processes?

The article does not address the potential challenges or limitations of scaling up the production of semiconductor structures using this technology.

Original Abstract Submitted

a semiconductor structure is presented including a first level of interconnect wiring separated into a first interconnect wiring segment and a second interconnect wiring segment, the first interconnect wiring segment defining a first line segment and the second interconnect wiring segment defining a second line segment and a second level interconnect wiring positioned orthogonally to the first level of interconnect wiring. a distalmost end of the first line segment and a distalmost end of the second line segment are separated by a spacing less than or equal to a spacing of the second level interconnect wiring defining a zero track skip.