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Category:H01L27/01
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Pages in category "H01L27/01"
The following 21 pages are in this category, out of 21 total.
1
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17957847. GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18067703. STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18149099. DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18508663. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18512092. 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
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- Taiwan semiconductor manufacturing company, ltd. (20240105707). Semiconductor Structures And Methods Of Forming The Same simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Texas instruments incorporated (20240113094). GALVANIC ISOLATION DEVICE simplified abstract
- Texas instruments incorporated (20240113095). STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract
- Texas instruments incorporated (20240113096). DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE simplified abstract
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024