US Patent Application 18447832. SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Masahiko Arimura of Kyoto-shi (JP)
Daiki Yanagishima of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447832 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor device with two insulated die pads: a high-voltage die pad and a low-voltage die pad. A resistive element is mounted on the high-voltage die pad, and a semiconductor element is mounted on the low-voltage die pad. The resistive element consists of a substrate mounted on the high-voltage die pad, an insulating layer formed on the substrate, and a thin film resistive layer formed on the insulating layer.
- The semiconductor device has separate die pads for high-voltage and low-voltage components.
- A resistive element is mounted on the high-voltage die pad.
- The resistive element includes a substrate, an insulating layer, and a thin film resistive layer.
- A semiconductor element is mounted on the low-voltage die pad.
Original Abstract Submitted
This semiconductor device is provided with: a high-voltage die pad and a low-voltage die pad, which are insulated from each other; a resistive element which is mounted on the high-voltage die pad; and a semiconductor element which is mounted on the low-voltage die pad. The resistive element is provided with: a substrate which is mounted on the high-voltage die pad; an insulating layer which is formed on the substrate; and a thin film resistive layer which is formed on the insulating layer.
