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Category:H01L23/50
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Pages in category "H01L23/50"
The following 23 pages are in this category, out of 23 total.
1
- 18106540. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18155914. CELL HAVING STACKED PICK-UP REGION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18174865. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18447788. CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18511533. INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517232. PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
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- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on January 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Texas Instruments Incorporated patent applications on February 29th, 2024