18511533. INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yi-Hsiung Lin of Hsinchu County (TW)
Yi-Hsun Chiu of Hsinchu County (TW)
Shang-Wen Chang of Hsinchu County (TW)
INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18511533 titled 'INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD OF FORMING THE SAME
Simplified Explanation
The device described in the patent application includes two semiconductor strips spaced apart from each other, with a power supply line located between them. A source feature on one of the semiconductor strips is electrically coupled to the power supply line through a source contact that physically contacts both the source feature and the power supply line.
- Device includes two semiconductor strips and a power supply line between them
- Source feature on one strip is connected to the power supply line through a source contact
- Source contact physically contacts both the source feature and the power supply line
Potential Applications
- Semiconductor devices
- Power supply systems
- Integrated circuits
Problems Solved
- Efficient power distribution within semiconductor devices
- Enhanced connectivity between semiconductor components
- Improved performance of integrated circuits
Benefits
- Increased efficiency in power supply distribution
- Enhanced connectivity and reliability of semiconductor components
- Improved overall performance of electronic devices
Original Abstract Submitted
A device includes a first semiconductor strip and a second semiconductor strip extending longitudinally in a first direction, where the first semiconductor strip and the second semiconductor strip are spaced apart from each other in a second direction. The device also includes a power supply line located between the first semiconductor strip and the second semiconductor strip. A top surface of the power supply line is recessed in comparison to a top surface of the first semiconductor strip. A source feature is disposed on a source region of the first semiconductor strip, and a source contact electrically couples the source feature to the power supply line. The source contact includes a lateral portion contacting a top surface of the source feature, and a vertical portion extending along a sidewall of the source feature towards the power supply line to physically contact the power supply line.
