18517232. PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Der-Chyang Yeh of Hsinchu (TW)
Hsien-Wei Chen of Hsinchu (TW)
Jie Chen of New Taipei City (TW)
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN - A simplified explanation of the abstract
This abstract first appeared for US patent application 18517232 titled 'PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Simplified Explanation
The patent application describes a package design with metal pads, including a corner metal pad and non-center-facing metal pads.
- The package includes a corner, a device die, redistribution lines, and metal pads.
- The corner metal pad is a center-facing pad with a bird-beak direction pointing towards the center.
- There are non-center-facing metal pads with bird-beak directions pointing away from the center.
Potential Applications
- Semiconductor packaging
- Integrated circuit design
Problems Solved
- Improved electrical coupling in packages
- Enhanced signal transmission efficiency
Benefits
- Better performance in electronic devices
- Increased reliability in package design
Original Abstract Submitted
A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.
