Category:H01L23/00
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- Section H: Electricity
- Class H01: Basic Electric Elements
- Subclass H01L: Semiconductor Devices; Electric Solid State Devices Not Otherwise Provided For
- Main Group H01L23/00: Devices Consisting of a Plurality of Semiconductor or Other Solid-State Components Formed in or on a Common Substrate
This classification encompasses devices that are composed of multiple semiconductor or solid-state components, which are constructed in or on a shared substrate. It typically includes integrated circuits (ICs) and microelectronic components where various active and passive elements are integrated into a single unit. This area is central to modern electronics, underlying the technology in computer chips, smartphones, and a wide range of electronic devices and systems.
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This category has only the following subcategory.
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Pages in category "H01L23/00"
The following 26 pages are in this category, out of 2,965 total.
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- US Patent Application 18365063. PACKAGE COMPRISING AN INTEGRATED DEVICE CONFIGURED FOR SHAREABLE POWER RESOURCE simplified abstract
- US Patent Application 18365362. INTEGRATED CIRCUIT PACKAGE AND METHOD simplified abstract
- US Patent Application 18366282. Antenna Apparatus and Method simplified abstract
- US Patent Application 18446014. MULTI-TIM PACKAGES AND METHOD FORMING SAME simplified abstract
- US Patent Application 18446028. BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME simplified abstract
- US Patent Application 18446076. STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE simplified abstract
- US Patent Application 18446146. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract
- US Patent Application 18446554. DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING simplified abstract
- US Patent Application 18446562. Polymer Layer in Semiconductor Device and Method of Manufacture simplified abstract
- US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18446748. SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE simplified abstract
- US Patent Application 18446834. POLYIMIDE PROFILE CONTROL simplified abstract
- US Patent Application 18447409. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- US Patent Application 18447416. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME simplified abstract
- US Patent Application 18447428. Semiconductor Package and Method of Forming Thereof simplified abstract
- US Patent Application 18447460. STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME simplified abstract
- US Patent Application 18447560. PACKAGED DEVICE WITH OPTICAL PATHWAY simplified abstract
- US Patent Application 18447769. DUAL-SIDED ROUTING IN 3D SIP STRUCTURE simplified abstract
- US Patent Application 18447832. SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18447968. Storage Layers For Wafer Bonding simplified abstract
- US Patent Application 18448284. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18448869. APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICATING DISPLAY DEVICE simplified abstract
- US Patent Application 18449360. SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract
- US Patent Application 18450216. SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- US Patent Application 18450241. Non-Volatile Memory Device and Method of Operating the Same simplified abstract