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Category:H01L23/053
Subcategories
This category has the following 14 subcategories, out of 14 total.
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Pages in category "H01L23/053"
The following 61 pages are in this category, out of 61 total.
1
- 17535664. MULTIPLE DIE ASSEMBLY simplified abstract (International Business Machines Corporation)
- 17823157. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17874192. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18110639. REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES simplified abstract (MELLANOX TECHNOLOGIES, LTD.)
- 18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18331575. SEMICONDUCTOR APPARATUS, AUTHENTICITY DETERMINATION METHOD AND POWER CONVERSION APPARATUS simplified abstract (Mitsubishi Electric Corporation)
- 18374943. DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER (INTEL CORPORATION)
- 18428245. SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18429039. FABRICATION METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18433436. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18442758. SEMICONDUCTOR PACKAGE AND METHODS (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18444268. IC Structure with Stress-Release Pattern to Enhance Package Yield (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18453713. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18480254. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18480620. MOLDED PACKAGE AND POWER MODULE WITH TEMPERATURE SENSE CAVITY (Infineon Technologies AG)
- 18538889. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18539036. SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18608868. SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract (MICRON TECHNOLOGY, INC.)
- 18610934. POWER ELECTRONIC ASSEMBLY AND METHOD OF PRODUCING THE SAME simplified abstract (Infineon Technologies AG)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18752735. CHIP PACKAGE WITH MULTIPLE HBM STACKS (Advanced Micro Devices, Inc.)
- 18753091. CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18891287. Packaged Integrated Circuit Device Having A Deformable Lid, And Associated Methods (NXP USA, INC.)
- 18971047. FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE (ILLUMINA, INC.)
A
I
- Intel corporation (20250112206). DIE PLACEMENT WITHIN A FORMED CAVITY ON A REDISTRIBUTION LAYER
- Intel Corporation patent applications on April 3rd, 2025
- INTEL CORPORATION patent applications on April 3rd, 2025
- Intel Corporation patent applications on February 13th, 2025
- International business machines corporation (20240290730). DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING simplified abstract
- International Business Machines Corporation patent applications on August 29th, 2024
M
- Micron technology, inc. (20240222325). SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME simplified abstract
- MICRON TECHNOLOGY, INC. patent applications on July 4th, 2024
- Mitsubishi electric corporation (20240304567). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on September 12th, 2024
- Mitsubishi Electric Corporation patent applications on September 19th, 2024
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- Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250118683). IC Structure with Stress-Release Pattern to Enhance Package Yield
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240234223). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240243076). SEMICONDUCTOR DEVICE PACKAGE WITH STRESS REDUCTION DESIGN simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347439). CHIP PACKAGE HAVING MULTIPLE CHIPS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379475). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250149495). SEMICONDUCTOR PACKAGE AND METHODS
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 29th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on July 18th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
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- US Patent Application 17898834. INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 18366788. SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME simplified abstract