Taiwan semiconductor manufacturing company, ltd. (20250149495). SEMICONDUCTOR PACKAGE AND METHODS
SEMICONDUCTOR PACKAGE AND METHODS
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsiu-Jen Lin of Zhubei City TW
Hsuan-Ting Kuo of Taichung City TW
SEMICONDUCTOR PACKAGE AND METHODS
This abstract first appeared for US patent application 20250149495 titled 'SEMICONDUCTOR PACKAGE AND METHODS
Original Abstract Submitted
a semiconductor package and the method of forming the same are provided. the semiconductor package may include a substrate, a semiconductor package component having a semiconductor die bonded to the substrate, a lid attached to the substrate, and a first composite metal feature between the semiconductor package component and the lid. the first composite metal feature may include a first metal feature having a first material and a second metal feature having a second material. the first material may be an intermetallic compound. the second material may be different from the first material.