CHIP PACKAGE HAVING MULTIPLE CHIPS

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Shin-Puu Jeng of Po-Shan Village (TW)

Po-Hao Tsai of Taoyuan City (TW)

Po-Yao Chuang of Hsinchu (TW)

Feng-Cheng Hsu of New Taipei City (TW)

Shuo-Mao Chen of New Taipei City (TW)

Techi Wong of Hsinchu County (TW)

CHIP PACKAGE HAVING MULTIPLE CHIPS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18753091 titled 'CHIP PACKAGE HAVING MULTIPLE CHIPS

The abstract describes a chip package that includes a substrate structure with a redistribution structure and an insulating layer. The package also contains a first chip over the redistribution structure and a second chip under the substrate structure.

The chip package features a first molding layer over the redistribution structure and the first chip.
The second chip extends into the insulating layer from the bottom surface, with a portion of the insulating layer between the second chip and the redistribution structure.
The first sidewall of the first molding layer and the second sidewall of the redistribution structure are level with each other.

Potential Applications: - This technology could be used in the semiconductor industry for advanced chip packaging solutions. - It may find applications in electronic devices where space-saving and efficient chip design are crucial.

Problems Solved: - The chip package addresses the need for compact and reliable chip packaging solutions. - It provides a way to integrate multiple chips in a single package efficiently.

Benefits: - Improved space utilization in chip packaging. - Enhanced reliability and performance of electronic devices. - Cost-effective solution for chip integration.

Commercial Applications: Title: Advanced Chip Packaging Solutions for Enhanced Device Performance This technology could be utilized in the production of smartphones, tablets, laptops, and other electronic devices where compact and efficient chip packaging is essential. The market implications include improved product performance, reduced size, and potentially lower production costs.

Prior Art: Readers interested in exploring prior art related to this technology can start by researching chip packaging methods, semiconductor packaging innovations, and advancements in multi-chip integration.

Frequently Updated Research: Researchers in the field of semiconductor packaging and chip integration are continuously exploring new materials and techniques to improve chip performance and reliability. Stay updated on the latest developments in this area for potential advancements in chip packaging technology.

Questions about Chip Packaging Technology: 1. How does this chip packaging technology compare to traditional methods? This technology offers a more compact and efficient solution for chip integration compared to traditional packaging methods. It allows for better space utilization and improved performance in electronic devices.

2. What are the key advantages of integrating multiple chips in a single package? Integrating multiple chips in a single package can lead to reduced size, improved performance, and cost savings in electronic device manufacturing. It also simplifies the overall design and assembly process.

Original Abstract Submitted

A chip package is provided. The chip package includes a substrate structure including: a redistribution structure having a conductive pad; and an insulating layer under the redistribution structure. The chip package includes a first chip over the redistribution structure. The chip package includes a second chip under the substrate structure. A top portion of the second chip extends into the insulating layer from a bottom surface of the insulating layer, the bottom surface faces away from the first chip, and a portion of the insulating layer is between the second chip and the redistribution structure. The chip package includes a first molding layer over the redistribution structure and the first chip. A first sidewall of the first molding layer and a second sidewall of the redistribution structure are substantially level with each other.