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Category:H01F41/12
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Pages in category "H01F41/12"
The following 31 pages are in this category, out of 31 total.
1
- 17957875. FIELD SUPPRESSION FEATURE FOR GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18159245. HIGH-TEMPERATURE ELECTRICAL DEVICE AND METHOD OF MAKING THE SAME simplified abstract (Honeywell International Inc.)
- 18189325. THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES simplified abstract (QUALCOMM Incorporated)
- 18282023. MULTILAYER SUBSTRATE, INTEGRATED MAGNETIC DEVICE, POWER SOURCE APPARATUS, AND MULTILAYER SUBSTRATE PRODUCTION METHOD simplified abstract (NEC Corporation)
- 18493326. MULTILAYER COIL COMPONENT AND METHOD OF MANUFACTURING MULTILAYER COIL COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18604349. INSULATING DEVICE AND METHOD FOR MANUFACTURING INSULATING DEVICE (Kabushiki Kaisha Toshiba)
- 18604349. INSULATING DEVICE AND METHOD FOR MANUFACTURING INSULATING DEVICE (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18680535. DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES (TEXAS INSTRUMENTS INCORPORATED)
- 18891266. METHOD FOR MANUFACTURING ELECTRONIC COMPONENT (ROHM CO., LTD.)
- 18961423. POWER MODULE AND MANUFACTURING METHOD THEREOF (DELTA ELECTRONICS, INC.)
- 18978624. Coil Component (Samsung Electro-Mechanics Co., Ltd.)