METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

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METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

This abstract first appeared for US patent application 18891266 titled 'METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Original Abstract Submitted

A method for manufacturing an electronic component includes a substrate preparation process including preparing an insulative substrate, an insulation layer formation process including forming an insulation layer on the substrate, a penetration process including forming a through-hole penetrating through the insulation layer, and a wiring process forming a through-wiring in the through-hole. The through-wiring constitutes at least a part of a coil unit wound in a solenoid form. The method may further include, before the insulation layer formation process, a first metal layer formation process including forming a first metal layer on the substrate. The through-wiring is continuous with the first metal layer, and the coil unit includes the first metal layer.