18680535. DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES (TEXAS INSTRUMENTS INCORPORATED)
DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Sylvester Ankamah-kusi of McKinney TX US
Jonathan Almeria Noquil of Plano TX US
Rajen Manicon Murugan of Dallas TX US
DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES
This abstract first appeared for US patent application 18680535 titled 'DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES
Original Abstract Submitted
In examples, a semiconductor package comprises a semiconductor die, and an inductor coupled to the semiconductor die. The inductor comprises a first metal coil having a first end coupled to the semiconductor die and a second end; a second metal coil vertically spaced from the first metal coil and having a third end coupled to the second end and a fourth end coupled to the semiconductor die; a magnetic mold compound (MMC) between the first and second metal coils, the MMC including conductive ions; and an insulative layer between the first and metal coils.