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Category:CPC H01J37/32926
Pages in category "CPC H01J37/32926"
The following 32 pages are in this category, out of 32 total.
1
- 18027200. APPARATUS DIAGNOSTIC APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS SYSTEM, AND SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM simplified abstract (HITACHI HIGH-TECH CORPORATION)
- 18124401. INDIRECT PLASMA HEALTH MONITORING simplified abstract (Applied Materials, Inc.)
- 18495458. MODEL-DRIVEN PRESSURE ESTIMATION (Applied Materials, Inc.)
- 18924053. IGNITION CONDITION CALCULATION METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- 18926695. SUBSTRATE PROCESSING SYSTEM WITH CAPABILITIES FOR DETECTING WHETHER A WAFER IS DECHUCKED AND A METHOD THEREOF (ASM IP Holding B.V.)
- 19001626. ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
- 19002147. CONTROL METHOD OF SUBSTRATE PROCESSING APPARATUS INCLUDING PARTIALLY ETCHING A WORKPIECE TO FROM A RECESS IN THE WORKPIECE AND SUBSTRATE PROCESSING SYSTEM (TOKYO ELECTRON LIMITED)
- 19004463. PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
2
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- Samsung electronics co., ltd. (20240274416). PLASMA PROCESS SIMULATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD INCLUDING THE SAME simplified abstract
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
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- Tokyo electron limited (20250149315). ADJUSTMENT METHOD AND PLASMA PROCESSING APPARATUS
- Tokyo electron limited (20250149316). PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025
- Tokyo Electron Limited patent applications on May 8th, 2025
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