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Category:B24B37/10
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This category has the following 19 subcategories, out of 19 total.
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Pages in category "B24B37/10"
The following 27 pages are in this category, out of 27 total.
1
- 17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17940403. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18230528. CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROLLING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18377599. RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL (Applied Materials, Inc.)
- 18393077. POLISHING APPARATUS AND POLISHING METHOD simplified abstract (EBARA CORPORATION)
- 18417304. APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18419867. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18477159. CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES (Applied Materials, Inc.)
- 18481513. INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP (Applied Materials, Inc.)
- 18481576. CMP WITH INDIVIDUALLY ROTATABLE PLATENS (Applied Materials, Inc.)
- 18610375. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18894292. METHOD OF PROCESSING WORKPIECE (DISCO CORPORATION)
- 18946379. CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME (Samsung Electronics Co., Ltd.)
- 18977686. TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
A
- Applied materials, inc. (20250108476). TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250108477). CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
- Applied materials, inc. (20250114896). INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP
- Applied materials, inc. (20250114898). RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
- Applied materials, inc. (20250114899). CMP WITH INDIVIDUALLY ROTATABLE PLATENS
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
S
T
- Taiwan semiconductor manufacturing co., ltd. (20240217054). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024