Applied materials, inc. (20250114899). CMP WITH INDIVIDUALLY ROTATABLE PLATENS
CMP WITH INDIVIDUALLY ROTATABLE PLATENS
Organization Name
Inventor(s)
Jeonghoon Oh of Saratoga CA US
Ekaterina A. Mikhaylichenko of San Jose CA US
Andrew J. Nagengast of Sunnyvale CA US
Takashi Fujikawa of San Jose CA US
Kuen-Hsiang Chen of Sunnyvale CA US
Jay Gurusamy of Santa Clara CA US
Steven M. Zuniga of Soquel CA US
Huanbo Zhang of San Jose CA US
CMP WITH INDIVIDUALLY ROTATABLE PLATENS
This abstract first appeared for US patent application 20250114899 titled 'CMP WITH INDIVIDUALLY ROTATABLE PLATENS
Original Abstract Submitted
a chemical mechanical polishing apparatus includes an inner platen to support an inner polishing pad, aan annular outer platen to support an outer polishing pad, a carrier head to hold a substrate, a first motor to rotate the inner platen about a vertical axis at a first rotation rate, and a second motor to rotate the outer platen about the vertical axis at a second rotation rate. the outer polishing pad coaxially surrounds the inner platen, and an outer edge of the inner platen and an inner edge of the outer platen are separated by a gap.
- Applied materials, inc.
- Eric Lau of Santa Clara CA US
- Jeonghoon Oh of Saratoga CA US
- Ekaterina A. Mikhaylichenko of San Jose CA US
- Andrew J. Nagengast of Sunnyvale CA US
- Takashi Fujikawa of San Jose CA US
- Kuen-Hsiang Chen of Sunnyvale CA US
- Jay Gurusamy of Santa Clara CA US
- Steven M. Zuniga of Soquel CA US
- Huanbo Zhang of San Jose CA US
- B24B37/10
- B24B37/34
- CPC B24B37/105