18377599. RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL (Applied Materials, Inc.)
RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
Organization Name
Inventor(s)
Brian J. Brown of Palo Alto CA US
Christopher Heung-Gyun Lee of San Jose IN US
Huanbo Zhang of Santa Clara CA US
Ekaterina A. Mikhaylichenko of San Jose CA US
RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
This abstract first appeared for US patent application 18377599 titled 'RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
Original Abstract Submitted
A method for chemical mechanical polishing includes bringing a substrate into contact with a polishing pad, causing relative motion between the substrate and polishing pad, dispensing a polishing liquid onto the polishing pad, holding the substrate in a lateral position with a retaining ring secured to a carrier head, and rotating the carrier head about an axis of rotation. The retaining ring has a plurality of channels extending from an inner diameter surface of the retaining ring to an outer diameter surface of the retaining ring such that rotation cause the polishing liquid to be preferentially expelled from a region below an outer edge of the substrate through the plurality of channels.
- Applied Materials, Inc.
- Zhize Zhu of Cupertino CA US
- Brian J. Brown of Palo Alto CA US
- Christopher Heung-Gyun Lee of San Jose IN US
- Huyen Tran of San Jose CA US
- Huanbo Zhang of Santa Clara CA US
- Eric Lau of Santa Clara CA US
- Ekaterina A. Mikhaylichenko of San Jose CA US
- B24B37/10
- B24B37/32
- B24B57/02
- CPC B24B37/105