Applied materials, inc. (20250114896). INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

Organization Name

applied materials, inc.

Inventor(s)

Eric Lau of Santa Clara CA US

Jeonghoon Oh of Saratoga CA US

Ekaterina A. Mikhaylichenko of San Jose CA US

Andrew J. Nagengast of Sunnyvale CA US

Takashi Fujikawa of San Jose CA US

Kuen-Hsiang Chen of Sunnyvale CA US

Jay Gurusamy of Santa Clara CA US

Steven M. Zuniga of Soquel CA US

Huanbo Zhang of San Jose CA US

INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

This abstract first appeared for US patent application 20250114896 titled 'INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP

Original Abstract Submitted

a chemical mechanical polishing apparatus includes: an inner platen to support an inner polishing pad; an annular outer platen to support an outer polishing pad; a carrier head to hold a substrate; one or more motors to rotate the inner platen about a vertical axis at a first rotation rate and to rotate the outer platen about the vertical axis at a second rotation rate; and a controller configured to select values for multiple control parameters to minimize a difference between a target removal profile and an expected removal profile, the multiple control parameters including a first parameter representing a difference in rotational speeds between the inner and outer platens. the outer polishing pad can coaxially surround the inner platen, and an outer edge of the inner platen and an inner edge of the outer platen can be separated by a gap.