18419867. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Nobuhiko Mouri of Kumamoto (JP)
Takanori Obaru of Kumamoto (JP)
Yasushi Takiguchi of Kumamoto (JP)
Teruhiko Kodama of Kumamoto (JP)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18419867 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The substrate processing method described in the patent application involves a both-surface cleaning process followed by a side end cleaning process to clean a substrate thoroughly.
- The method includes using a first cleaning body to clean one surface of the substrate while a second cleaning body simultaneously cleans the remaining surface.
- The first and second cleaning bodies move horizontally in synchronization towards the outer peripheral portion of the substrate.
- A third cleaning body is used to clean the side end of the substrate while the both-surface cleaning process is ongoing.
- The third cleaning body is rotated around a vertical axis to ensure thorough cleaning of the side end of the substrate.
Potential Applications: - This method can be used in semiconductor manufacturing processes to ensure clean substrates for further processing. - It can also be applied in the production of optical components where cleanliness is crucial for performance.
Problems Solved: - Ensures thorough cleaning of both surfaces and side ends of substrates. - Improves the overall quality of substrates used in various industries.
Benefits: - Enhanced cleanliness of substrates leading to improved product quality. - Increased efficiency in substrate processing operations.
Commercial Applications: - Semiconductor manufacturing industry. - Optical component production companies.
Questions about the technology: 1. How does this method compare to traditional substrate cleaning processes? 2. What are the specific parameters that need to be controlled for optimal cleaning results?
Frequently Updated Research: - Stay updated on advancements in substrate cleaning technologies to enhance the efficiency and effectiveness of the method described in the patent application.
Original Abstract Submitted
A substrate processing method includes: performing a both-surface cleaning processing in which a first cleaning body, which ejects the fluid to the one surface or is brought into contact with the one surface, and subsequently moves both the first cleaning body and a second cleaning body, which is in contact with the remaining surface of the upper surface and the lower surface of the substrate and rotated around a first vertical axis, horizontally in synchronization with each other toward an outer peripheral portion of the substrate, and performing a side end cleaning processing in which a third cleaning body is rotated around a second vertical axis and brought into contact with the side end of the substrate to clean the side end of the substrate while simultaneously performing the both-surface cleaning processing.
