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Category:B24B37/04
Subcategories
This category has the following 39 subcategories, out of 39 total.
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B
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Pages in category "B24B37/04"
The following 76 pages are in this category, out of 76 total.
1
- 17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17940403. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17966021. MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract (Intel Corporation)
- 18085768. CHEMICAL MECHANICAL POLISHING OF METAL GATE CUTS FORMED AFTER SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation)
- 18185849. METHOD FOR DETECTION OF WAFER SLIPPAGE simplified abstract (Applied Materials, Inc.)
- 18210819. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226873. CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18274991. POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING (Applied Materials, Inc.)
- 18294859. POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD simplified abstract (Resonac Corporation)
- 18294889. POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD simplified abstract (Resonac Corporation)
- 18301462. Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18376282. POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL (Applied Materials, Inc.)
- 18377591. EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
- 18377615. GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
- 18383226. CMP SLURRY COMPOSITION FOR POLISHING TUNGSTEN AND METHOD OF POLISHING TUNGSTEN USING THE SAME simplified abstract (SAMSUNG SDI CO., LTD.)
- 18418868. CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18436499. DEFORMABLE SUBSTRATE CHUCK simplified abstract (Applied Materials, Inc.)
- 18483971. HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE (Applied Materials, Inc.)
- 18483973. RETAINING-RING-LESS CMP PROCESS (Applied Materials, Inc.)
- 18528713. POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT simplified abstract (EBARA CORPORATION)
- 18610375. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18667585. CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18771727. SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18817224. POLISHING PAD WITH IMPROVED SLURRY FLOWABILITY AND PROCESS FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME (SK enpulse Co., Ltd.)
- 18897639. POLISHING DEVICE, POLISHING METHOD, AND MACHINE PART (NHK SPRING CO., LTD.)
- 18999881. SLURRY, SCREENING METHOD, AND POLISHING METHOD (RESONAC CORPORATION)
2
A
- Applied materials, inc. (20240253179). POLISHING HEAD WITH LOCAL WAFER PRESSURE simplified abstract
- Applied materials, inc. (20250001547). FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Applied materials, inc. (20250108473). POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL
- Applied materials, inc. (20250114897). EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250114901). GROOVES FOR EDGE AND HOT SPOT COMPENSATION IN CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250114902). HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE
- Applied materials, inc. (20250114903). RETAINING-RING-LESS CMP PROCESS
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on January 2nd, 2025
B
I
- Intel corporation (20240123561). MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract
- Intel corporation (20240213026). CHEMICAL MECHANICAL POLISHING OF METAL GATE CUTS FORMED AFTER SOURCE AND DRAIN CONTACTS simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on June 27th, 2024
S
- Samsung display co., ltd. (20240292725). MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME simplified abstract
- Samsung Display Co., LTD. patent applications on August 29th, 2024
- Samsung electronics co., ltd. (20240208005). CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240217059). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CONTROLLING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240278383). CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING METHOD simplified abstract
- Samsung electronics co., ltd. (20250115785). SLURRY COMPOSITION FOR CHEMICAL MECHANICAL METAL POLISHING AND POLISHING METHOD USING THE SAME
- Samsung Electronics Co., Ltd. patent applications on April 10th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 10th, 2025
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240181598). MONOLITHIC PLATEN simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240217054). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240327677). CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF POLISHING METAL LAYER simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240304455). CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240342856). Methods of Forming an Abrasive Slurry and Methods for Chemical-Mechanical Polishing simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240375236). SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 15th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
U
- US Patent Application 17824930. APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract
- US Patent Application 17968608. OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract
- US Patent Application 18100937. POLISHING PAD AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME simplified abstract
- US Patent Application 18446842. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD simplified abstract
- US Patent Application 18447211. SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION simplified abstract