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Category:B24B37/005
Subcategories
This category has the following 19 subcategories, out of 19 total.
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Pages in category "B24B37/005"
The following 35 pages are in this category, out of 35 total.
1
- 17870340. WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18144711. CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18185849. METHOD FOR DETECTION OF WAFER SLIPPAGE simplified abstract (Applied Materials, Inc.)
- 18226873. CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18274991. POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING (Applied Materials, Inc.)
- 18296021. CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING SYSTEM USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18376282. POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL (Applied Materials, Inc.)
- 18377591. EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
- 18478649. FINDING SUBSTRATE NOTCH ON SUBSTRATE BETWEEN PLATENS IN CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
- 18481513. INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP (Applied Materials, Inc.)
- 18528713. POLISHING DEVICE AND METHOD FOR ADJUSTING PRESSURE CONTROL UNIT simplified abstract (EBARA CORPORATION)
- 18542093. SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING LAYER DURING POLISHING simplified abstract (Applied Materials, Inc.)
- 18601670. ZONE-BASED CMP TARGET CONTROL simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
A
- Applied materials, inc. (20240253179). POLISHING HEAD WITH LOCAL WAFER PRESSURE simplified abstract
- Applied materials, inc. (20250108473). POLISHING HEAD WITH DECOUPLED MEMBRANE POSITION CONTROL
- Applied materials, inc. (20250108474). FINDING SUBSTRATE NOTCH ON SUBSTRATE BETWEEN PLATENS IN CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250114896). INDIVIDUALLY ROTATABLE PLATENS AND CONTROL OF CARRIER HEAD SWEEP
- Applied materials, inc. (20250114897). EDGE AND HOT SPOT COMPENSATION TECHNIQUES IN CHEMICAL MECHANICAL POLISHING
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on February 20th, 2025
- Applied Materials, Inc. patent applications on February 6th, 2025
S
- Samsung electronics co., ltd. (20240157502). CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240208005). CLEANER FOR CHEMICAL MECHANICAL POLISHING APPARATUS simplified abstract
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024