18144711. CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
Organization Name
Inventor(s)
DONGHOON Kwon of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18144711 titled 'CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS
Simplified Explanation
The patent application describes a chemical mechanical polishing apparatus with a polishing pad that includes a transmissive part overlapping an opening in the polishing platen. The apparatus also includes a slurry supply providing a slurry with a photocatalyst to the polishing pad, a head part for mounting a wafer, and a light irradiation part positioned within the opening of the polishing platen.
- Polishing platen with an opening
- Polishing pad with a transmissive part
- Slurry supply with a photocatalyst
- Head part for wafer mounting
- Light irradiation part within the opening
Potential Applications
The technology described in the patent application could be used in the semiconductor industry for polishing wafers to achieve precise flatness and smoothness required for high-quality semiconductor devices.
Problems Solved
This technology solves the problem of achieving uniform and efficient polishing of wafers by incorporating a photocatalyst in the slurry and using light irradiation to enhance the polishing process.
Benefits
The benefits of this technology include improved polishing efficiency, enhanced surface quality of wafers, and increased productivity in semiconductor manufacturing processes.
Potential Commercial Applications
"Enhancing Wafer Polishing Efficiency with Photocatalyst Slurry and Light Irradiation"
Possible Prior Art
There may be prior art related to chemical mechanical polishing apparatus with various configurations of polishing pads, slurry supply systems, and light irradiation mechanisms. Further research is needed to identify specific examples of prior art in this field.
Unanswered Questions
How does the incorporation of a photocatalyst in the slurry improve the polishing process?
The article does not provide details on the specific mechanism through which the photocatalyst enhances the polishing efficiency.
What are the potential limitations or challenges in implementing this technology in semiconductor manufacturing?
The article does not address any potential obstacles or drawbacks that may arise when integrating this technology into existing semiconductor manufacturing processes.
Original Abstract Submitted
This disclosure relates to a chemical mechanical polishing apparatus, and may include: a polishing platen including an opening; a polishing pad positioned on the polishing platen and including a transmissive part overlapping the opening; a slurry supply supplying a slurry including a photocatalyst to the polishing pad; a head part positioned on the polishing pad and capable of mounting a wafer; and a light irradiation part positioned within the opening of the polishing platen.