Category:Conor P. Puls of Portland OR US
Conor P. Puls
Conor P. Puls from Portland OR US has applied for patents in technology areas such as H01L23/522, H01L23/528 with intel corporation.
Patents
Pages in category "Conor P. Puls of Portland OR US"
The following 16 pages are in this category, out of 16 total.
1
- 18375084. INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING (INTEL CORPORATION)
- 18467859. MITIGATING PROXIMITY EFFECTS OF DEEP TRENCH VIAS (Intel Corporation)
- 18469810. VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING (Intel Corporation)
- 18471356. INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER DELIVERY (Intel Corporation)
- 18491111. ELECTRICALLY SELF-INSULATED VIA (Intel Corporation)
- 18498318. INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS (Intel Corporation)
- 18498519. DOUBLE-SIDED CONDUCTIVE VIA (Intel Corporation)
I
- Intel corporation (20250006547). INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN
- Intel corporation (20250006579). MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY USING BACKSIDE PASSIVATION LAYER
- Intel corporation (20250096114). VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING
- Intel corporation (20250098249). MITIGATING PROXIMITY EFFECTS OF DEEP TRENCH VIAS
- Intel corporation (20250105095). INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER DELIVERY
- Intel corporation (20250112120). INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING
- Intel corporation (20250132245). ELECTRICALLY SELF-INSULATED VIA
- Intel corporation (20250140748). DOUBLE-SIDED CONDUCTIVE VIA
- Intel corporation (20250142948). INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS